专利名称：ELECTRIC COMPONENT, IN PARTICULAR A
COIL, PREFERABLY FOR AN SMD ASSEMBLYTECHNIQUE
发明人：HAGN, ERWIN申请号：EP95941585.2申请日：19951215公开号：EP0799487B1公开日：19990714
摘要：The present invention is to be related to a kind of electronic component, andthis electronic component is in particular in the form of coil, and preferably, provides akind of SMD assembly technologies. In order to facilitate in component, particle (4) isapplied to a surface elements, especially its top, which has flat surface, and will notlaterally protrude over the component.
申请人：HAGN, ERWIN,HAGN ERWIN,HAGN, ERWIN
地址：DE
国籍：DE
代理机构：R.A. KUHNEN & P.A. WACKER
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