Casting of raised bump contacts on a substrate

专利名称：Casting of raised bump contacts on a

substrate

发明人：Robert T. Trabucco申请号：US08/121676申请日：19930915公开号：US05381848A公开日：19950117

摘要：A technique for simultaneously forming large numbers of solder ball (or bump)contacts on a surface of a substrate is described. A mold is provided for receiving asubstrate. Recesses in the mold are shaped to form contacts of a desired size, and arearranged to align with contact pads on the surface of the substrate. When the substrateis inserted into the mold and the mold is closed, the contact pads align with the recesses.Molten solder is introduced into the recesses and, upon cooling, forms conductive raisedbump contacts on the contact pads. The substrate is then removed from the mold.Various features of the invention are directed to forming \"tall\" contacts with an aspectratio (height to width ratio) of greater than 1:1, processing more than one substrate at atime, processing substrates of different sizes, and processing substrates with differentcontact patterns.

申请人：LSI LOGIC CORPORATION

代理人：Honigman Miller

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