TRANSFERRING AN ANTENNA TO AN RFID INLAY SUBSTRATE

专利名称：TRANSFERRING AN ANTENNA TO AN RFID

INLAY SUBSTRATE

发明人：David Finn申请号：US13027415申请日：20110215

公开号：US20120080527A1公开日：20120405

专利附图：

摘要：Forming antenna structures having several conductor turns (wire, foil,conductive material) on a an antenna substrate (carrier layer or film or web), removingthe antenna structures individually from the antenna substrate using pick & place gantry

or by means of die punching, laser cutting or laminating, and transferring the antennastructure with it's end portions (termination ends) in a fixed position for mounting ontoor into selected transponder sites on an inlay substrate, and connecting the alignedtermination ends of the antenna structure to an RFID (radio frequency identification) chipor chip module disposed on or in the inlay substrate. A contact transfer process iscapable of transferring several antenna structures simultaneously to several transpondersites.

申请人：David Finn

地址：Tourmakeady IE

国籍：IE

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