专利名称：Method for electro copperplating
substrates
发明人：JURGEN HUPE,WALTER
KRONENBERG,EUGEN BREITKREUZ,ULRICHSCHMERGEL
申请号：AU4261799申请日：19990514公开号：AU4261799A公开日：19991206
摘要：A process for the copper plating of substrates using insoluble anodes in acidiccopper baths with separate replenishing of consumed copper ions, characterized in thatthe major portion of the copper ions is directly supplied in the form of copper carbonateand/or basic copper carbonate, dispensing with diaphragms and auxiliary electrolytes, in aseparate tank operated in a bypass mode with respect to the working electrolyte, thereleased gaseous CO2 being separated off in said separate tank.
申请人：BLASBERG-OBERFLACHENTECHNIK GMBH
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