专利名称：Method for filling electrically different
features
发明人：Dale W. Collins,Rita J. Klein申请号：US10931822申请日：20040901
公开号：US20060046453A1公开日：20060302
专利附图：
摘要：Methods of electroless filling electrically different features such as contactopenings to form interconnects and conductive contacts, and semiconductor devices,dies, and systems that incorporate the interconnects and contacts are disclosed. The
contact openings are electrically shorted together with a selective material, a nucleationlayer is selectively deposited onto the area to be plated (e.g., the base of the opening),and a conductive material is electroless plated onto the nucleation layer to fill theopening. The process achieves substantially simultaneous filling of openings havingdifferent surface potentials at an about even rate.
申请人：Dale W. Collins,Rita J. Klein
地址：Boise ID US,Boise ID US
国籍：US,US
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容