Multi-chip integrated circuit module

专利名称：Multi-chip integrated circuit module发明人：Harm Peter Hofstee,Robert Kevin

Montoye,Edmund Juris Sprogis

申请号：US09736584申请日：20001214

公开号：US20020074668A1公开日：20020620

专利附图：

摘要：A multi-chip module is disclosed in which a first die connects to a second set ofdie via a set of C4 connections within a single package. Low resistivity signal posts areprovided within the lateral separation between adjacent die in the second set of die.

These signal posts are connectable to externally supplied power signals. The powersignals provided to the signals posts are routed to circuits within the second set of dieover relatively short metallization interconnects. The signal posts may be connected tothermally conductive via elements and the package may include heat spreaders on upperand lower package surfaces. The first die may comprise a DRAM while the second set ofdie comprise portions of a general purpose microprocessor. The power signals providedto the second set of die may be connected to a capacitor terminal in the first die toprovide power signal decoupling.

申请人：INTERNATIONAL BUSINESS MACHINES CORPORATION

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