专利名称：Semiconductor device having semiconductor
chip mounted on lead frame
发明人：Yasuhiro Taguchi申请号：US14644249申请日：20150311公开号：US09698064B2公开日：20170704
专利附图：
摘要：A semiconductor device uses a lead frame, in which an outer lead is electricallyconnected to an inner lead suspension lead via an inner lead. An encapsulating resincovers the inner lead and part of the outer lead, and a plated film is formed on an outer
lead cut surface so that a solder layer is easily formed on all surfaces of the outer leadextending from the encapsulating resin. The inner lead suspension lead includes anarrowed portion that is smaller in cross-sectional area than other portions of the innerlead suspension lead to suppress impact forces generated when the inner leadsuspension lead is cut.
申请人：SEIKO INSTRUMENTS INC.
地址：Chiba-shi, Chiba JP
国籍：JP
代理机构：Adams & Wilks
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