Flip chip semiconductor apparatus with projecting

专利名称：Flip chip semiconductor apparatus with

projecting electrodes and method forproducing same

发明人：Tsukasa Shiraishi,Yoshihiro Bessho申请号：US09117695申请日：19980804公开号：US06452280B1公开日：20020917

专利附图：

摘要：A semiconductor apparatus in which the height of the projected electrode ()formed on the semiconductor element () is deformed plastically so as to unify the

distance of the protruding surface of the projected electrode () and the surface of theelectrode terminal () at the side of the circuit substrate (), and the semiconductorelement and the circuit substrate are connected electrically with reliability. A method forproducing the semiconductor apparatus also is disclosed. After the semiconductorelement () is positioned on the predetermined part of the circuit substrate (), theprojected electrode () is deformed plastically by pushing the semiconductor element ()from the back and the height of the projected electrode () is processed appropriately.According to the method for producing the semiconductor apparatus, even if there isirregularity of the height of the surface of the electrode terminal () formed on the circuitsubstrate () which connects with the semiconductor element (), the semiconductorelement () and the circuit substrate () can be connected electrically with reliability.

申请人：MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

代理机构：Merchant & Gould P.C.

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