Die dyed film

专利名称：Die dyed film

发明人：福井 章洋,高本 尚英,木村 雄大,宍戸 雄一郎,杉村

敏正

申请号：JP2018227882申请日：20181205公开号：JP2020092157A公开日：20200611

专利附图：

摘要：Problem to be solved: to provide a ddaf suitable for securing a sufficient cuffwidth for an intersecting portion between chips while realizing a good breakage in anextrusion process using a dyed dialed film (ddaf) to obtain a semiconductor chip with adie bond film. The ddaf of the present invention has a laminated structure including a diebond film 10 and dicing tape 20.The die bonding film 10 is releasably adhered to theadhesive layer 22 of the dicing tape 20.The die bonding film 10 has a tensile elongation of20% or less in a tensile test under predetermined conditions.The die bond film 10 has adisc shape of a diameter D1, and includes a wafer adhesion region of a diameter D2 of thedisc shape and concentric circle.D1 and D2 satisfy 0 < (d1-d2) \\/ D2 < 1.The dicing tape 20

has a tensile elongation of 120% or more in a tensile test under predeterminedconditions.Diagram

申请人：日東電工株式会社

地址：大阪府茨木市下穂積１丁目１番２号

国籍：JP

代理人：特許業務法人後藤特許事務所

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