专利名称：METHOD OF MOLDING A REINFORCED
ARTICLE
发明人：MCCULLOUGH, Kevin, A.申请号：EP00921754.8申请日：20000406公开号：EP1292435A1公开日：20030319
摘要：A kind of method of moulding strengthens product (100) and is used forexcellent structured thermal transfer, the offer of conductivity and/or structuralintergrity. Die assembly provides the required construction that can form article (100)first, may include pedestal (112) and upstanding fins (114). Expected location filler is toneed product (100) according to heat, electricity or structure in molded article (100).Input gate exports grid (116) and exhaust outlet (118) is formed in die assembly, toensure that filler is located in desired position. Polymer, loading and reinforcing fillerintroduce die assembly and pass through input gate (116). It is substantially parallel andand flow path that polymer, which is located at die assembly with reinforcing filler,. Thereis the bottom surface (112) of pedestal (120) flushing which of heat generating devicethermal communication can be positioned at specified region (122) with.
申请人：CHIP COOLERS, Inc.
地址：333 Strawberry Field Road Warwick, RI 02886 US
国籍：US
代理机构：Hofstetter, Alfons J., Dr.rer.nat.
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