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PACKAGE OPTION ADDENDUM
www.ti.com
20-Aug-2011
PACKAGING INFORMATION
Orderable Device
CD4086BECD4086BEE4CD4086BF3ACD4086BMCD4086BME4CD4086BMG4CD4086BMTCD4086BMTE4CD4086BMTG4
(1)
Status
(1)
Package TypePackage
Drawing
PDIPPDIPCDIPSOICSOICSOICSOICSOICSOIC
NNJDDDDDD
Pins141414141414141414
Package Qty
25251505050250250250
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
Samples(Requires Login)
ACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVE
Pb-Free (RoHS)Pb-Free (RoHS)
TBDGreen (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)
CU NIPDAUN / A for Pkg TypeCU NIPDAUN / A for Pkg Type
A42
N / A for Pkg Type
CU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIM
The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availabilityinformation and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms \"Lead-Free\" or \"Pb-Free\" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines \"Green\" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
芯天下--http://oneic.com/
PACKAGE OPTION ADDENDUM
www.ti.com
20-Aug-2011
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4086B, CD4086B-MIL :
•Catalog: CD4086B•Military: CD4086B-MIL
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
Addendum-Page 2
芯天下--http://oneic.com/
PACKAGEMATERIALSINFORMATION
www.ti.com
14-Jul-2012
TAPEANDREELINFORMATION
*Alldimensionsarenominal
Device
PackagePackagePinsTypeDrawingSOIC
D
14
SPQ
ReelReelA0DiameterWidth(mm)(mm)W1(mm)330.0
16.4
6.5
B0(mm)9.0
K0(mm)2.1
P1(mm)8.0
WPin1(mm)Quadrant16.0
Q1
CD4086BMT250
PackMaterials-Page1
芯天下--http://oneic.com/
PACKAGEMATERIALSINFORMATION
www.ti.com
14-Jul-2012
*Alldimensionsarenominal
DeviceCD4086BMT
PackageType
SOIC
PackageDrawing
D
Pins14
SPQ250
Length(mm)
367.0
Width(mm)367.0
Height(mm)
38.0
PackMaterials-Page2
芯天下--http://oneic.com/
芯天下--http://oneic.com/芯天下--http://oneic.com/
芯天下--http://oneic.com/
芯天下--http://oneic.com/
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TIhasspecificallydesignatedcertaincomponentswhichmeetISO/TS16949requirements,mainlyforautomotiveuse.Componentswhichhavenotbeensodesignatedareneitherdesignednorintendedforautomotiveuse;andTIwillnotberesponsibleforanyfailureofsuchcomponentstomeetsuchrequirements.ProductsAudioAmplifiersDataConvertersDLP®ProductsDSP
ClocksandTimersInterfaceLogicPowerMgmtMicrocontrollersRFID
OMAPMobileProcessorsWirelessConnectivity
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www.ti.com/wirelessconnectivity
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