Preferred Device
SWITCHMODEtPower Rectifier
These state−of−the−art devices are designed for power factorcorrection in discontinuous and critical conduction mode.
Features
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••••••
520 V Rating Meets 80% Derating Requirements of Major OEMsLow Forward Voltage DropLow Leakage
Ultrafast 95 Nanosecond Recovery TimeReduces Forward Conduction LossPb−Free Packages are Available
ULTRAFAST RECTIFIER5.0 AMPERES, 520 VOLTS
MARKING DIAGRAMS
Applications
AXIAL LEADCASE 267STYLE 1•DCM PFC Designs
•Switching Power Supplies•Power Inverters
Mechanical Characteristics:
•Case: Epoxy, Molded
•Epoxy Meets UL 94 V−0 @ 0.125 in
•Weight:MUR550APF: 1.1 Gram (Approximately)••
AMUR550APFYYWWGGMURD550PF: 0.4 Gram (Approximately)MUR550PF: 1.9 Gram (Approximately)
Finish: All External Surfaces Corrosion Resistant and TerminalLeads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:220°C Max. for 10 Seconds
41213
DPAKCASE 369C
YWW
U550G
4
3Pin 1: No Connect
4TO−220ACCASE 221BPLASTIC14AY WWGMUR550PFKA13
3A= Assembly LocationYY, Y= YearWW= Work Week
G or G= Pb−Free PackageKA= Diode Polarity
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the packagedimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 20061
February, 2006 − Rev. 2
Publication Order Number:
MUR550/D
MUR550APF, MURD550PF, MUR550PF
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse VoltageWorking Peak Reverse VoltageDC Blocking VoltageAverage Rectified Forward Current(Rated VR) TC = 65°C(Rated VR) TC = 160°C
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, 60 Hz)
MUR550APF
MURD550PF, MUR550PF
MUR550APFMURD550PFMUR550PF
SymbolVRRMVRWMVRIF(AV)
Value520
UnitV
5.0A
IFSM
A
8575100−65 to +175−65 to +175> 400>8000
°C°CV
Operating Junction Temperature RangeStorage Temperature RangeESD Ratings:
Machine Model = C
Human Body Model = 3B
TJTstgESD
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limitvalues (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Rating
Thermal Resistance, Junction−to−Case (Note 1)
MURD550PF, MUR550PF
Thermal Resistance, Junction−to−Ambient
MUR550APF
MURD550PF (Note 3)
1.Rating applies when surface mounted on the minimum pad sizes recommended.2.See Note 2, Ambient Mounting Data.3.1 inch square pad size on FR4 board.
SymbolRqJCRqJA
Value2.8Note 262
Unit°C/W°C/W
ELECTRICAL CHARACTERISTICS
Rating
Maximum Instantaneous Forward Voltage Drop (Note 4)(IF = 5.0 A, TJ = 25°C)(IF = 5.0 A, TJ = 150°C)Maximum Instantaneous Reverse Current (Note 4)(VR = 520 V, TJ = 25°C)(VR = 520 V, TJ = 150°C)Maximum Reverse Recovery Time
(IF = 1.0 A, di/dt = 50 A/ms, VR = 30 V, TJ = 25°C)4.Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤2.0%.
SymbolVF
Value1.150.985.040095
mAUnitV
IR
trr
ns
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2
MUR550APF, MURD550PF, MUR550PF
NOTE 2 — AMBIENT MOUNTING DATA
Data shown for thermal resistance junction−to−ambient(RqJA) for the mountings shown is to be used as typicalguideline values for preliminary engineering or in case thetie point temperature cannot be measured.TYPICAL VALUES FOR RqJA IN STILL AIRMountingMethod12RqJA3Lead Length, L (IN)1/81/41/23/4505153555859616328Units°C/W°C/W°C/WMOUNTING METHOD 1P.C. Board Where Available CopperSurface area is small.LLMOUNTING METHOD 2Vector Push−In Terminals T−28LLMOUNTING METHOD 3P.C. Board with1−1/2″x1−1/2″Copper SurfaceL = 1/2″Board Ground Planehttp://onsemi.com
3
MUR550APF, MURD550PF, MUR550PF
iF, INSTANTANEOUS FORWARD CURRENT (AMPS)IF, INSTANTANEOUS FORWARD CURRENT (AMPS)100100
1010
1.0
150°C1.0
150°C125°C0.1
0
0.2
0.4
0.6
25°C0.8
1.0
1.2
1.4
1.6
125°C0.1
0
0.2
0.4
0.6
25°C0.8
1.0
1.2
1.4
1.6
vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE
(VOLTS)
Figure 1. Typical Forward VoltageFigure 2. Maximum Forward Voltage
1.0E−3IR, REVERSE CURRENT (AMPS)1.0E−4IR, MAXIMUM REVERSE CURRENT (AMPS)1.0E−31.0E−41.0E−51.0E−61.0E−71.0E−81.0E−90
25°C150°C125°C150°C1.0E−5125°C1.0E−61.0E−725°C1.0E−81.0E−90100200300400500100200300400500
VR, REVERSE VOLTAGE (VOLTS)VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse CurrentFigure 4. Maximum Reverse Current
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4
MUR550APF, MURD550PF, MUR550PF
IF, AVERAGE FORWARD CURRENT (AMPS)PFO, AVERAGE POWER DISSIPATION(WATTS)10
dc109876543210012345678910IO, AVERAGE FORWARD CURRENT (AMPS)SQUAREWAVEdcSQUARE WAVE5
0100110120130140150160170180TC, CASE TEMPERATURE (°C)Figure 5. Current DeratingFigure 6. Forward Power Dissipation100C, CAPACITANCE (pF)1025°C1050100150200VR, REVERSE VOLTAGE (VOLTS)
Figure 7. Capacitance
R(t), TRANSIENT THERMAL RESISTANCE1000.50.20.10.0510.010.1Single Pulse0.010.000001
0.00001
0.0001
0.001
0.01t, TIME (s)
0.1
1.0
10P(pk)t1t210DUTY CYCLE, D = t1/t2100
1000
Figure 8. Thermal Response for MUR550APF
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5
MUR550APF, MURD550PF, MUR550PF
R(t), TRANSIENT THERMAL RESISTANCE100.510.20.10.050.01Single Pulse0.1P(pk)t1t2DUTY CYCLE, D = t1/t20.010.000001
0.00001
0.0001
0.001
0.01t, TIME (s)
0.1
1.0
10
100
1000
Figure 9. Thermal Response for MURD550PF
R(t), TRANSIENT THERMAL RESISTANCE100.510.20.10.050.10.01Single PulseP(pk)t1t2DUTY CYCLE, D = t1/t20.010.000001
0.00001
0.0001
0.001
0.01t, TIME (s)
0.1
1.0
10
100
1000
Figure 10. Thermal Response for MUR550PF
ORDERING INFORMATION
Device
MUR550APFMUR550APFGMUR550APFRLMUR550APFRLGMURD550PFT4MURD550PFT4GMUR550PFMUR550PFG
PackageAxial*Axial*Axial*Axial*DPAKDPAK(Pb−Free)TO−220TO−220(Pb−Free)
Shipping†500 Units/Bag500 Units/Bag1500 Tape & Reel1500 Tape & Reel2500 Tape & Reel2500 Tape & Reel50 Units/Rail50 Units/Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecification Brochure, BRD8011/D.*This package is inherently Pb−Free.
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6
MUR550APF, MURD550PF, MUR550PF
PACKAGE DIMENSIONS
AXIAL LEADCASE 267−05ISSUE G
KD1A2NOTES:
1.DIMENSIONS AND TOLERANCING PER ANSIY14.5M, 1982.
2.CONTROLLING DIMENSION: INCH.
3.267−04 OBSOLETE, NEW STANDARD 267−05.
INCHESMINMAX0.2870.3740.1890.2090.0470.0511.000−−−MILLIMETERSMINMAX7.309.504.805.301.201.3025.40−−−BKDIMABDKSTYLE 1:
PIN 1.CATHODE (POLARITY BAND)
2.ANODE
DPAK
CASE 369C−01
ISSUE O
NOTES:
1.DIMENSIONING AND TOLERANCINGPER ANSI Y14.5M, 1982.
2.CONTROLLING DIMENSION: INCH.
INCHESMINMAX0.2350.2450.2500.2650.0860.0940.0270.0350.0180.0230.0370.0450.180 BSC0.0340.0400.0180.0230.1020.1140.090 BSC0.1800.2150.0250.0400.020−−−0.0350.0500.155−−−
MILLIMETERS
MINMAX5.976.226.356.732.192.380.690.880.460.580.941.144.58 BSC0.871.010.460.582.602.892.29 BSC4.575.450.631.010.51−−−0.891.273.93−−−
−T−BV
R4SEATINGPLANECES
A123ZUKFLDG2 PLJH0.13 (0.005)MTDIMABCDEFGHJKLRSUVZ
SOLDERING FOOTPRINT*
6.200.2442.580.1015.800.2281.60.0636.1720.2433.00.118SCALE 3:1
mmǓǒinches*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.
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7
MUR550APF, MURD550PF, MUR550PF
PACKAGE DIMENSIONS
TO−220 TWO−LEADCASE 221B−04ISSUE D
CQBFTSNOTES:
1.DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.
2.CONTROLLING DIMENSION: INCH.
DIMABCDFGHJKLQRSTUINCHESMINMAX0.5950.6200.3800.4050.1600.1900.0250.0350.1420.1470.1900.2100.1100.1300.0180.0250.5000.5620.0450.0600.1000.1200.0800.1100.0450.0550.2350.2550.0000.050MILLIMETERSMINMAX15.1115.759.6510.294.064.820.640.893.613.734.835.332.793.300.460.6412.7014.271.141.522.543.042.042.791.141.395.976.480.0001.274A13UHKLGDJRSWITCHMODE is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liabilityarising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. Alloperating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rightsnor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicationsintended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. ShouldBuyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or deathassociated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an EqualOpportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:N. American Technical Support: 800−282−9855 Toll FreeLiterature Distribution Center for ON SemiconductorUSA/CanadaP.O. Box 61312, Phoenix, Arizona 85082−1312 USAPhone: 480−829−7710 or 800−344−3860 Toll Free USA/CanadaJapan: ON Semiconductor, Japan Customer Focus Center2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051Fax: 480−829−7709 or 800−344−3867 Toll Free USA/CanadaPhone: 81−3−5773−3850Email: orderlit@onsemi.comON Semiconductor Website: http://onsemi.comOrder Literature: http://www.onsemi.com/litorderFor additional information, please contact yourlocal Sales Representative.http://onsemi.com8MUR550/D
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